半导体晶片载体

Semiconductor wafer carrier

Abstract

Semiconductor wafers and a method for protecting the semiconductor wafers are disclosed. A preferred embodiment comprises a carrier with a central region and an exterior region. The exterior region preferably has a thickness that is greater than the central region, to form a cavity in the carrier. An adhesive is preferably placed into the cavity, and a semiconductor wafer is placed onto the adhesive. The edges of the semiconductor wafer are protected by the raised exterior region as well as the displaced adhesive that at least partially fills the area between the semiconductor wafer and the exterior region of the carrier.
公开了半导体晶片载体以及用于保护半导体晶片的方法。优选实施例包括具有中心区域和外围区域的载体。优选地,外围区域具有大于中心区域的厚度,以在载体中形成腔。优选将粘合剂放置在腔中,并将半导体晶片放置在粘合剂上。通过凸出的外围区域以及至少部分地填充半导体晶片和载体的外围区域之间的区域的所移位的粘合剂,来保护半导体晶片的边缘。

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (0)

    Publication numberPublication dateAssigneeTitle